[SOLVED]Altium direct-connect leaves slivers around pads & vias ?

[smoothVTer]

Using Altium v16.1.12

When making a ground pour, I have all my rules set to "Direct Connect" and my polygon pour settings are set to "Pour Over Same Net Objects":



When a Gerber export is done, I notice that ground vias ( which I've connected the ground pour to, by net ) have tiny little slivers around them.   These slivers are apparent in Altiums CamTastic view as well as any other external Gerber viewer ( such as gerbv ).  For example, in the image below, there's a non-GND via all the way on the right side of the image, and directly to the left of this is a via on GND.   There are slivers of copper missing from around the via periphery:

• Does anybody have an idea as to the source of these missing copper slivers and how to fill them in?
• Do PCB manufacturers already know how to handle this kind of malformed gerber data and if so, is it really a problem
  that requires fixing?

[dimkasta]

These are thermals

Look for the setting that removes/adds them on vias

[smoothVTer]

Ah yes ... that did the trick. 

For reference with anyone else having this problem, my error was that I had originally set the default via-connect style as in the picture below:



But the correct setting for direct-connect for all other vias not part of the higher priority rules is:



Altium users:    remember to set your default connect styles for all other vias using the ALL/ALL keywords.