Hello again,
Thank you for your replies
My design is all smd. The temperature fluctuations where the device will be installed in the engine compartment, is high. -40 - 125*C.
1 Will placeing a shield around the oscillator fix the problem, or is the epoxy going to kill the other SMD components as well?
2. Is the potting compound so watery, that it will find its way under the shield, and fill that cavity? In other words, is the viscosity high enough to keep out of small gaps?
3. I have a hole in one end of the enclosure where the connector tabs poke out. This is where I inject the potting compound. This compound has to be pretty hard when cured, otherwise the end user may insert things by accident. Are you able to recommend a compound which is hard enough to prevent the end user to insert items into this end, whilst simultaneously not destroying my smd components? Because it is visible, black is preferred.
4. Where should I buy low volume of potting compound?
Thank you for your time.
Kind regards,
Marius