I recently tried reflow soldering for the first time. I'd done hand soldering of SMD parts before, down to QFP-type pacakges, but this time was confronted with a QFN-20 that I didn't see any way to hand solder (especially the center ground pad), so I gave reflow soldering a try.
Got a stainless stencil from OSHStencils and some paste, and made up two versions of a small board - one with a hot air station, the other with an unmodified toaster oven (just my Fluke DMM temp probe stuck through the door and a piece of thin aluminum placed under the board on top of the rack). The hot air station did ok, the toaster did great.
So now I'm wondering - does this sort of home technique work on BGA chips? Or are those too finicky for this to work?