There is no resistivity on hi freqs, just impedance , if you have your metal so thin that the normal surface oxide will matter, than is too thin. For hi freqs, usually the bigest problem is not the DC resistance but change of the impedance and q factor of the circuits, not to mention the resonance frequency. this why there a attempts to protect the conduits.
What?
At high frequencies resistance still very much matters, as this resistance is what causes the loss. Surface oxide can increase the loss of the traveling wave for a number of reasons - A less perfect surface finish of the conductive layer, which increases losses (this is why rolled copper is less lossy than plated copper), a conductive 'alloy' of oxide and non-oxidized material that carries a lot of current due to skin-effect, again increasing loss. I think for many applications at 'low' (low being a few GHz) the oxide layer acting as dielectric will have negligible impact on impedance since it is so tiny compared to the wavelength. What does impact it is it's effect on the resistance component of the conductors and that can increase the impedance. (Remember that a basic transmission line model starts with series R and L, with parallel G and C - in most cases we ignore R and G, but if R becomes significant, it will start impacting the impedance).
Of course as you've mentioned the thicker the metal, the less influence has the oxidation, but for many applications this solution is not possible (strip antennas and friends). Better put a 4 microns layer of gold on it and be done .
I'm not sure this is true either - at a certain point, most of your energy will be at the surface anyways due to skin effect. Making things much thicker past this point doesn't really help, and so the impact of oxidation will be almost the same.
Well, there IS a reason why the strip line and PCB antennas from 2,4GHz up are covered with gold, mainly for the fact that the gold will conduct better, and stopping the oxidation will not hurt either.
And sadly I'm far removed from a microwave wizard .
Cheers,
DC1MC
This is also not true.
The reason starts out with soldermask. I copy this from a
stackexchange answer I wrote a while back:
Soldermask is applied as a liquid. As such, its thickness may not be as well controlled and predicable as the thickness of the substrate and conductor layers. In addition, it may have an unpredictable profile - how does it "flow" in between the traces? All of this means that you cannot accurately model the impact of the solder mask on your line, and cannot predict the impedance of the trace.
This is even important on any distributed element filter or microwave component such as a directional coupler, resonator, power combiner, etc. In these cases, a very small shift in the ϵeff of the system will potentially shift the center frequency out of the band of interest.
With high-performance RF substrates we can get very accurate models, provided we know very precisely the etch profile of the process. The unpredictable nature of solder mask ruins this.
So, we don't want solder mask on top of the transmission lines. But copper oxidizes a lot. As a result we want to add a layer to stop this from happening. On normal boards there are a number of ways of doing this - I myself am not an expert. Most of them I think are called "HASL" (hot air solder leveling). I believe this involves some tin alloy being plated onto the board. But the problem is that the thickness of the layer is unpredictable - not a problem for normal PCB work, but unacceptable for the precise tolerances we have on our transmission lines. So instead, we tend to use much thinner platings on those PCBs, usually Hard gold (electroplated gold over electroless nickel), ENIG (Electroless Nickel, Immersion Gold) or ENIPIG/ENEPIG (electroless nickel, immersion/electroless Palladium, immersion gold) - the difference between these has to do with wirebond capabilities. These platings are very, very thin - a few micrometers at best, and tend to have much better surface finish.
However, all of these finished has higher loss than pure copper, as can be seen in this paper:
https://ece.uwaterloo.ca/~oramahi/IEEE-TADVP-Surface-Feb2008.pdf or this magazine:
http://iconnect007.uberflip.com/i/586473-pcbd-oct2015/53?m4=. The argument that they use these finishes for lower loss is a myth spread by people who assume that gold being a better conductor than copper must mean putting it on top of copper gives us lower losses - in most cases the layer of gold is tiny (less than a micrometer thick) and the nickel needed to support it is much thicker (a few micrometers), and nickel is a much worse conductor. In addition, surface finish is hurt. The reason they use gold is because gold doesn't form an oxide layer, unlike most other plating, which form a thin, passivating oxide (=oxide layer that is not penetrable by oxygen, and as a result protects the underlying material from oxidizing further).
To put some stuff into context, I work with very high frequencies (tens to hundreds of GHz), so I don't know how some of this stuff translates to more 'common' frequencies in the <6 GHz applications.