Worst case method, but functional if all else fails...
Solder the device down with all pins as a glump of solder, on both sides.
Use a solder wick, on all the pins, one side at a time after waiting for cooling.
The solder wick should remove the glump, leaving just enough under the pins for a good contact.
Don't apply too much pressure otherwise you'll remove too much. It takes a little practice, but I've done some truly fine QFPs this way with a similar pin pitch.
When solder wicking, make sure you iron temp isn't too hot or it will melt the other side releasing the part from the PCB.