Okay, here is my layout in a closeup with the GND plane showing. I did try to match the datasheet somewhat closely when I made it, but I see I may have pretty been off the mark. I have no thermal vias and the ground trace for U2 is pretty skinny. Should these issues actually lead to total failure and damage to the IC?
I'm not 100% sure. You are running the chip well under the limits but not much copper area for heat sinking. Could be in conjunction with the lack of an input cap. Do you have an oscope? worth at least poking around to see if there's something amiss.
No matter what, I'd add an input cap, re-layout the switcher part to have more ground copper, add 10-20 thermal vias to as large a ground plane as you can get on the bottom. Give the heat a big fat channel to get away from the IC. You can cram the vias together fairly tight. [edit]also, move L1 closer to the SW pin. The DS talks about minimizing ringing[/edit]
Also, I would double check that you haven't gotten any of the other switcher components misinstalled. Check see that all your caps and resistors aren't damaged. Inspect and cont. check the PCB itself.