I have been using sodium persulfate. What is the score with this.
The basic etchants have the least amount of undercutting. I'm not sure if sodium is the same as ammonium persulfate, but I have read it goes like this
best etchant to worst, regarding undercutting. And my memory might be wrong:
ammonium persulfate 1:8
ferric chloride 1:5
cupric chloride 1:4 (when done properly with aeration and no peroxide)
HCl and peroxide would be 1:1
Even if a 1 oz board takes 40 minutes with cupric, the board will still be ok even if I leave it in for maybe as much as 4 hours. It's only if I forget and sleep on it that I have ruined a board. I literally sometimes don't even look at a clock. Just do something else for "awhile."
i have read some really confounding write ups on how ammonium persulfate manages to undercut so little. Some magic hoohah stuff. I think it's very easy to understand that if it takes multiple large ions to be in proximity to a molecule of elemental copper in order to etch it, you will have less undercutting in a thin layer of copper compared to a little peroxide molecule and a free proton being able to quickly diffuse into any crevice and zap anything in sight.
The good etchant is thusly so because it diffuses slower in between the mask and the copper, and it's concentration will be lower in these tight spaces. After it does manage to etch, the concentration is now low in this crevice and diffusion back towards the mean concentration in the rest of the tank is relatively slower. Also, it will very dramatically slow or stall at below a critical concentration, because it takes multiple of these ions (lining up like an eclipse, through random molecular movement) to coincindentally be in position to gang up on one copper molecule. Whereas it takes only a single peroxide molecule to oxidize copper, then a single free proton in water to etch it away. So acid peroxide concentration will not drop as much in these tight spaces because it diffuses more easily, being smaller, plus it does not dramatically drop off/stop when the concentration drops, anyway. There's no "knee" in the acid peroxide curve. It's more linear.
Additionally, any peroxide that decomposes on the board (or under the resist) will leave a gas bubble of pure oxygen on the copper, which will be able to oxidize the copper much faster than an air bubble due to higher concentration. Plus decomposing peroxide under the mask might also mechanically loosen it.
If you do only an occasional board of modest trace size once a year, you can use any of these etchants. If you need high resolution, or if you do more than a rare board, you probably want to use any of the proper etchants and not the acid peroxide stuff, in particular. If you want to mass produce boards at home in any significant quantity, you really don't want to use acid peroxide. Poor yield; more labor/watching; more wasted time and effort and materials.
And using cupric chloride without adequate aeration is almost as bad as acid peroxide. When the board stalls, you WILL add more acid and peroxide. Cupric doesn't practically work without either good aeration or a giant tank with low duty cycle, and poking holes in a piece of aquarium tubing doesn't cut it for the former. BTDT. Made a giant 2-3 liter tank with fish tank pumps and 4 lines of "poked hole tubing" for bubblers in it... total garbage. I was having to constantly add acid and peroxide to get boards to finish, and results and yields were terrible. 1/2 L tank with copious air and fine, high pressure bubbler leaves it in the dust with very significantly better fidelity and essentially 100% yields to a decimal point or 2. It was a revelation. Completely different etch quality.
I would bet the majority of these guys using cupric after reading theRealElliot's writeup are actually etching primarily with acid peroxide. Yeah, you got your fish tank bubbler going. But be honest; that bottle of peroxide is like American Express. You don't etch a board without it. Cupric is simply not practical for the average hobbyist, IMO (unless acid peroxide is good enough, anyway). If acid peroxide is not producing good enough or consistent enough results, cupric probably won't be sigificantly better in the way you will probably end up using it... which will be using cupric to etch the first 1/3 of the copper, then adding peroxide to finish the board, because it won't finish without it. You might justify it that "if I waited another hour, it would finish, but I'm in a hurry." Nope. With no or inadequate aeration, it could take days for the board to finish without the peroxide.
I didn't discover this on my own. When I started doing this, there were enough nuggets of good information out there that I wanted to see what happens when I actually do it right. That info might still be out there, but the modern internet seems to be geared more towards swamping out good with popular. The way theRealElliot has taught the world's greater audience to use cupric, you are really just letting the cupric recharge between uses so it doesn't slow down your diluted acid peroxide etchant too badly.