They also
mention the metal slugs ( connected to pins 5 and 8 ) protruding each end of the package. I checked the actual chip and you can see bare metal on each end.
So this bare metal is 2mm from pins 1 and 4. How does this impact the isolation on a real board?
The proposed device will have an exposed RS485 interface. I was wanting to keep the signal 0V floating with respect to mains earth to avoid loops (via the PE) when multiple devices are interconnected.
My take on it was that there is only 2mm isolation between the current sense side and the output side due to those end pieces. Cutting a slot below the sensor helps with the creepage figure between the SOIC package pins of course.