Hmm. Assuming the mosfets are being driven cleanly, looking at the gerbers, you probably want better heat conductivity from the drain pads of those mosfets. As it is, you have the thermal relief (which makes it easier to hand solder). You probably want to eliminate that and have some thermal vias to copper on the other side. This kind of package is heavily reliant on those drain connections for thermal conductivity.
A look at the waveform between the S1/D2 node and ground on a scope might clarify whether the mosfets are switching as expected -- don't forget that the connections need to be really short, including the ground lead.