In EEVblog #859 Dave explained the need for multiple bypass capacitors with different values if you want to minimize the noise on the input of ICs. I was wondering how much this would be necessary in small DC-DC converter circuits.
Here's an example chip, but there are many like it:
http://ww1.microchip.com/downloads/en/DeviceDoc/25173A.pdfWhat I'm trying to do is to minimize the number of different parts (simplify the BOM). In the MCP16251 chip the typical application diagram shows a 4.7uF cap at the input and a 10uF cap at the output. However, by placing a 10uF on both sides I can shorten the BOM by one part (and they cost almost the same). In this particular case, I'm fairly certain it wouldn't change anything, because the difference isn't much. However, sometimes you see two different capacitors with two different values on the input, especially when you look at the schematic of demo boards where they often over-design things.
It seems like the input caps in these circuits are pulling double-duty: they have to act as the DC-DC converter circuit's input cap, but also act as the IC's bypass (since these are mixed logic-and-power ICs).
To simplify things a bit, the circuits I'm talking about only use ceramic caps, I wouldn't expect a large electrolytic to act as the bypass cap.
Some datasheets don't give you much to work with in terms of specificity. Some of them just give you a value for the total capacitance on each side -- "place 22uF of low-ESR capacitance at the input". In those cases I really have no information to work with.
Sorry if this is over-worded... Fundamentally the question is: Do DC-DC chips need additional small-value (1uF or 100nF) caps at the input to act as bypass caps?