Will I be able to build these using an iron and/or hot air reflow? Or will I need a reflow oven? I’d probably use larger SMD diodes on the ZCD board.
I don't think an oven is really needed for that.
You can probably solder all components using a hand solder and a lot of flux.
O have done that up to TSSOP pitches with no problem.
For SOIC pitches there is no problem at all.
You can use hot air, but I don't think it is really needed for exposed lead components. I only really need hot air for unleaded components like QFNs.
Having soldermask on the board helps a lot as also helps using custom footprints that take into account that the board will be hand soldered.
It all depends on volume. Reflow is good for high volume as you solder all components at once.
One problem with oven reflow is that it requires solder paste and when it expires after some storage time it can give unreliable soldering.
I’ve not done any SMD parts or boards before but have reasonable soldering iron skills.
It is not that difficult, really.
You just need to use the proper thecniques.
Depending on how I go, I may make boards to sell in limited quantities. Would that change the ideal method for populating the boards?
Yes, because the soldering method affects the time needed to assembly each board.
For medium volumes, having a solderpaste stencil and a reflow oven can come handy for boards with a lot of SMDs.