If the FR-4 bubbled, it may have gotten hot enough to char. And this can make the board conductive. If you have high voltage on there, the board can conduct and arc and char more, and you get a runaway problem that ends in blown fuse, at best, somewhere down the road.
I have never seen soldermask bubble, so I assume your board substrate may have been damaged.
If you scrape off the mask and there's no brown or dark spots in the FR-4 next to the traces, it is probably fine. I'd tin it to prevent oxidation and call it good. The worst of the heat damage will be on the surface, not underneath. If charred, then what he said. This is just my opinion, not any kind of certifiable repair standard.