I know there were quite a few QIL packaged chips with over 120 pins, though there they typically had a 0.05in pitch, and thus would fit into the DIP32 footprint. Mostly used in things like copiers, cash registers and calculators as they could put almost the entire control logic into a single part to cut assembly cost and improve reliability. You still would have a board which was single sided SRBP with 600 wire links of 6 different sizes on it, 10 resistors, a diode and 4 capacitors, but it was only one chip.
The issue IIRC with higher pin counts was making the leadframe, as this was normally made using a sheet of tin plated KOVAR alloy, and this then had the frame punched out using a die set. Had to be wide enough so the resin could bond with the metal, and also had to be self supporting during manufacture with the chip epoxied to the die paddle and with the bond wires completed.
There were some CERDIP packages made with multiple layers of screen printed traces, used to get 200 plus bond wires out into the package, but those tended to be either Intel processor chips or militare or Aerospace parts, and were not a regular part.
You can buy blank CERDIP packages still that are designed to have a regular SMD or bare die attached into them, then have a lid soldered on, as replacement for no longer produced DIP parts which are currently only available in a SMD or bare die form. some are multichip packages as well, to replace older mask ROM processors with a modern die with no onboard storage, adding on the package an internal flash or EPROM chip ( OTP of course) and glue logic, to make a drop in replacement part for the older unit. Saves having to respin a board and have the system recertified, along with having a non standard spare part unit that means you need to either replace all boards in service and storage, or have 2 different boards and update test procedures and manuals all over.