I want to point out that it's also a hint that the volumes on the assembled device are relatively low. If they were high, the manufacturer could easily ask for parts with their own label and/or part number on the ICs (probably for free or almost for free). In this way, they could hide the part identification for the device without looking amateurish and without paying for the cost of someone to drill/sand it off, or the time required to put the device or IC in a jig to laser etch it off.
So it's only used for relatively low production volumes, and it only defeats relatively low skilled or low effort reverse engineering attempts. Low skilled because it's not difficult at all to take a completely populated board with labeled ICs, depopulate the board, and completely reverse the thing. I could do this, and I'm barely beyond monkey level intelligence. Low effort because, many ICs are labelled with identifying information on-die, so a hot plate, some fuming nitric acid, and a decent microscope are all that are needed to overcome this.