Author Topic: Silver Epoxy for Ground Paddles  (Read 1660 times)

0 Members and 1 Guest are viewing this topic.

Offline kraphtTopic starter

  • Contributor
  • Posts: 25
Silver Epoxy for Ground Paddles
« on: August 15, 2013, 01:46:16 am »
Hello,

I'm currently designing a 915 MHz oscillator. I want to use a small DFN RF amplifier in my circuit. I've never hand-soldered a part with a thermal paddle - and normally I'd just pick another part, but since this project is on my own time, I'd like to explore outside my comfort zone.  I do have a hot air gun.

The recommended layout has many vias to ground underneath the ground paddle. If I laid it out according to manufacturer recs, I don't think I'll ever solder the part correctly with my setup. One, the solder would wick down the vias, and two, my ground plane is an enormous heatsink.

Instead, I was thinking of using silver epoxy on the ground paddle and my hot air gun to reflow the leads. Has anyone done this before? Would it work?
 

Offline richard.cs

  • Super Contributor
  • ***
  • Posts: 1191
  • Country: gb
  • Electronics engineer from Southampton, UK.
    • Random stuff I've built (mostly non-electronic and fairly dated).
Re: Silver Epoxy for Ground Paddles
« Reply #1 on: August 15, 2013, 08:55:24 am »
My suspicion is that 1) thermal and electrical contact will be pretty poor and 2) the epoxy may be damaged when you solder the rest.

One way to hand-solder these is to heat the ground plane on the back with a hot plate and then solder from the front with an iron - the copper pad should extend past the end of the chip so you can get the solder to wick under onto the pad. Some people put a large plated through hole on these to hand-solder the thermal pad from behind. You may be able to get away with a hot air gun if you do it before you put other components down but I suspect you'll still need a hot plate to pre-heat the ground plane.

If you haven't made the PCB yet I would strongly suggest you deviate from what the manufacturer recomends as that will be for machine assembly and you can make your life a lot easier. So long as you have a low (electical and thermal) impedance path to your groundplane it should be fine. I would suggest extending the copper on the top layer above and below the chip and one large plated hole behind the chip instead of the many vias.
 

Offline SArepairman

  • Frequent Contributor
  • **
  • Posts: 885
  • Country: 00
  • wannabee bit hunter
Re: Silver Epoxy for Ground Paddles
« Reply #2 on: August 15, 2013, 06:50:53 pm »
I read that the solder coverage area of thermal pads is not as linear as I would think, I think the difference in heat dissipation ability from 50% coverage to 100% coverage was like 20%.

There might not be any need to fuss about it.
 


Share me

Digg  Facebook  SlashDot  Delicious  Technorati  Twitter  Google  Yahoo
Smf