Its also normal for the chip to "move" a little bit when it is reflowing, unless you are placing it perfectly aligned which is probably unlikely. It will naturally self center itself as the solder paste reflows. If the part doesn't move and self center, then this would be a bad sign as it means the solder is not melting completely and thus you will likely have dry joints.
Some solder pastes are more likely to bridge then others, generally the higher the flux activity the better, but higher activity flux usually requires cleaning afterwards. In general, no-clean solder pastes are not very high in activity.
You also don't need the paste all over the pad, if you can, try and put the solder paste primarily right in the middle of the pads and avoid going to near the pads edge.
But the amount of paste is the key.