Totally depends on the board, not the component. I solder 0402 with a 3mm TFO bevel tip if the board allows. Just pick up a nice dab of solder on the tip and turn the tip sideways to touch the bottom against the side of the component pad. Whether or not you can do this without reflowing unintended adjacent pads is the question, but since the tip is an oval, it only touches the board at one spot when you hold it like this. You might find there is a lot more clearance than you first think.
The problem with thin conical tips like you have linked is that surface tension sucks the solder away from the tip. It only works when you feed solder with your off hand. These are the worse tips for SMD passives. You have to dot one pad with solder, first, then reflow the pad to stick the part, then finish the other side. You are adding a step and wasting a lot of time, IMO. With a minimal pad size and a 3MM TFO bevel, you can solder these parts until the cows come home without having to pick up more solder to the tip. Just apply flux to the board, first, rather than dotting one pad of each component with solder.
Small tips are for debugging/modifying a board with fly wires. They are not necessary to rework/populate a board, in most cases. SMD parts and pads are for the most part (other than some connectors) designed to be compatible with wave soldering. The size of that "tip" is very large.