Of course, you need some connection to the ground plane, otherwise the chip and cap are just floating...
Figures I've heard are more like 3nH per via for an average thickness board. 10-15nH would be including component length and traces back to the IC pins, I would think?
Extra vias are handy from time to time; for example, if you want to place a lone bypass cap between planes, you can use four vias, each pair flanking each pad of the capacitor. Place them as close to the centerline as possible, given soldering limitations (keep a minimum solder mask sliver between pad and via, or tent the via, so solder doesn't creep into it; unless you want to go the way of via-in-pad, with its potential benefits and issues). This minimizes the loop area, and probably gives ~2nH total from plane to plane.
I don't think you'll see much gain from more than a couple vias. If you want to go whole-hog, your first choice should be ground flood on the top layer; that way you have a short perimeter around all traces and pads, and you can add stitching vias anywhere you please. Note that top side ground changes the characteristic impedance slightly; you have a coplanar waveguide with ground plane:
http://chemandy.com/calculators/coplanar-waveguide-with-ground-calculator.htmTim