Hello!
Look at the examples below.
I don't really get why they use vias on metallized holes or pads like that.
Is this connected with heat distribution? Does they make it to allow substrate to heat up evenly on both sides,
thus reducing the risk of copper pad to fall off during soldering of large components? Or maybe it's rather for something in connection with high current conduction? If I'm right, is it the only reason?
I got a THT component footprint with those vias and because I was not able to do such small ones it made me wonder if it's actually necessary. Any ideas
?