It is all about return path impedance, you likely know about the path of least resistance, but as your frequency (transition speed) increases, a greater share of the return current will try and follow as close as possible to the signal above, via stitching is a way to ensure that there is a smaller gap between them, as any deviation is both a noise source and seen as impedance,
If your edge rates are getting close to a 10Mhz sine wave, you follow the path of least impedance, and plan around that, above a 1Ghz sine, you ignore the path of lease resistance and focus only on impedance,
It can all so be used to increase power heatsinking on the board, if you have a lot of via's into a big ground plane right next to a high current power trace the increased surface area will soak up the heat better and let it run cooler,