You don't need paste - just tin the pads making sure not to pour too much, apply small amount of liquid flux to the tinned surface and hot air. If you still want to use paste, thin it with IPA to almost liquid state and apply with a toothpick. You can also apply paste to the part itself.
For 0402 I wouldn't even bother with reflow, it's big enough to be soldered with an iron. Tin one pad, solder one side by melting the tin on the pad and placing the part. Remove iron, turn the board around and solder other side. Liquid flux is your friend.