When soldering a through-hole IC, I first solder two diagonally opposite pins, then push the IC into place while re-heating the two pins (one at a time, of course). I believe this to be important especially when mechanical vibration may be an issue. After the other pins are soldered then I retouch the first two pins with a TINY amount of solder to ensure a good connection. Also you forgot to mention over-heating that can remove the pad from the board.
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