Hey guys.
didn't read all the posts on this topic, so sorry if this question already was answered.
what do you think, is this device capable of reflow bga components or would you have to heat up the µC so much to reflow the solder underneath so it would destroy the controller?
background to this particular question is: a while ago i was thinking of buying a quadcopter kit, but the controller board would require bga soldering, the fully assembled board would cost 150€ ( yep, i'm from germany ) more then the non assembled one.
now i'm wondering if this reflow oven could solve such assembly problems for those kits.
B_S