Cstratton, you are right, I don't have an automatic p&p, but have built myself a manual one. Speeds up the process of placing components about 3-5 times, depending on how many BOM items there are.
I have and use hot air station in combination with a hotplate preheated to 150°C to pre-soak the boards. However, using hot air station to reflow is slow and time does scale up with the number of components on the board and the size of the board as you need to move the air tool around, so I mainly use this for prototypes. Now I have 30+ boards to assemble and reflow. It's also a lot less controlled (temperature-wise) with the hot-air tool and these are not prototype boards so I want them to function ...and keep functioning.
I can tune the oven settings with a couple of boards to start with and then as long as the production boards are positioned in the same place every time on the same program, they should mostly come out good. Inspection is necessary, of course, and some re-work will probably be too, but doing this with hot-air station doesn't guarantee no solder bridges or fully reflowed under an exposed pad IC and rework might still be necessary. My feeling is that I'm only gaining by using the reflow oven in this particular situation.