I think there are a lot of misunderstanding regarding the relationship of TDP, Power consumption, Temperature, Thermal dissipation and Turbo Boost.
I start with Turbo Boost. Intel processors can up it's frequency above specs while using n-cores (not just 1-core). This means that a 4-core CPU can TB on all 4 cores as long as the designed max power consumption and temperatures are within defined specs. The TB is defined separately for 1-, 2-, 3- and 4-core operation. The settings could be for instance 2/2/7/9, which means the amount of frequency increment steps the CPU can take above specs. The numbers starting from left to right are defined for 4-, 3- 2- and 1-core boosting.
Example:
We have a 2GHz CPU and it's base frequency is 100MHz, this means that on 100% CPU usage with big enough heat sink the multiplier will be 2000MHz / 100MHz = x20.
So now we know the max frequencies we can get during TB.
Calculations:
n-cores --> ( MULTIPLIER_STEPS + TB_MULTIPLIER_STEPS ) x BASEFREQUENCY = MAX_TURBOBOOST_FREQUENCY
4-cores --> (20 + 2) x 100 = 2200
Resulting table based on above formula and values
Cores | TB Steps MAX | Freq. MAX |
4 | 2 | 2200 |
3 | 2 | 2200 |
2 | 7 | 2700 |
1 | 9 | 2900 |
All this info can be found in the CPU specifications (if someone dare to read hundreds if not thousands of pages of CPU specs) :-D
Max power consumption is not equal to TDP. You have to consult the CPU specifications documents in order to know how much power is required to run the processor. TDP is the minimum thermal dissapation capacity/power required for a cooling solution under normal CPU operation/load. You have to consult the specs sheet again for more details.
Finally we have temperature, the CPU speed is increased and decreased according to temp in relationship to Tjunction, again consult the specs sheets for more details, but basically this means the CPU will power off completely at 100C. And for example MAX turbo boost at a temperature of below 45C. (consult docs for exact values).
Simon, if your computer is something cheap, then it is very likely that the cooling solution is not good enough. The heat pipes, the thermal paste could be bad quality and the cooling solution max capacity was designed too close to TDP.
Hope I did clear up more confusions than I created by posting this. :-)