I said microapplication. Like dip a fine needle into super glue and tap it on the part. It takes skill. I think I used the 'ultra thin' super glue for this
0201 footprint has around 0.3 mm in between of the pads. Reliably placing glue in that gap without it bleeding on the pads is not possible. If it won't bleed while you placing the pad, it will once you place a component on top. Also as I said you should keep superglue out of electronics as it's conductive. But when heated it no longer holds. And with such small part glue will overheat immediately.
you can't really put glue on the part, I mean you make a kind of knife edge on the pcb area under it, like by brushing it with a wire that is pulled out of a high density cable (like flexible multimeter cable) to make a super glue mound, that you put the part ontop of, when its a bit wet.
The bond is very weak. I mean it literarly like micro-3d printing a little tower with your hands, not a single application that would deform.
36AWG is 0.1 mm for instance
You kind of need to let the glue cure a tiny bit, depending on the initial consistancy, to be able to do a layer-raise wipe that does not spill out and contact the pads, under some magnification
Maybe I can take a picture to explain better, let me see if I can find a thin enough wire strand. I tend to avoid these parts anyway because they don't offer me any benefit. I have a transformer somewhere that was wound with incredibly thin wire which I used as a brush element.