so then i should add an extra dap of thermal paste on the heat sink then right. will the stuff i have do or should i get this:
Arctic Silver 5 High-Density Polysynthetic Silver 3.5g Thermal Paste
The evo already has a layer of paste that is applied by a machine. You don't need to add more paste to anything for the first install. If you remove the heatsink then clean the old paste off the heatsink and the cpu with some alcohol and apply a small dot in the middle of the cpu. Your stuff most likely work but I can't comment on performance since I've never seen or used it. AS5 is a bit outdated, there are pastes that perform better and apply as easily so might as well get that if buying new. I use GC extreme. If you can't get that in Canada then just get AS5 since everything performs close to each other, except chocolate.
4GHz seems like a low clock for a 3930k. I think the average clock for SB-E at safe voltages was 4.9-5GHz. Average for IB-E was 4.7. Average for Haswell-E is 4.5. Try your thermal tests at the highest clock you can get at safe 24/7 voltages. You will find that the evo will either limit your max oc or you will have to turn fans up to the point where the system is too annoying.
I'm going for reliability and long lifetime, not hardcore benching. Just the fact that a fairly cheap cooler works great on a lightly overclocked 3930k is quite amazing in itself. Also surprising is how the servers get away with much smaller heatsinks even on the really hot 18 core Haswell-Es.
Nowadays, I do my Folding with my GPU.
Hardcore benching involves increasing the voltage above the 24/7 safe point. Take Haswell-E for example where the safe voltage is about 1.3v. Run at that and your cpu will last until it's time to replace it. For benching you can go 1.35v or more if you want but you might lower the life span. Go more and you can degrade it, but you can always buy the intel tuning plan.
A xeon on an evo is different than a consumer chip on an evo. They are designed for low power and low voltage operation. They are much higher grade chips. For example the 18 core Haswell-E has basically the same TDP as the consumer Haswell-E chips like the 5820k, yet it has 12 more cores. They also cannot be overclocked much. Here is the 18 core xeon:
It runs at a max of 51c under load with an AIO cpu cooler and on a test bench where there is basically no air flow.
Just the fact that a fairly cheap cooler works great on a lightly overclocked 3930k is quite amazing in itself. Also surprising is how the servers get away with much smaller heatsinks even on the really hot 18 core Haswell-Es.
That is what I have been writing all along: a standard case has no proper airflow so the cooler is recycling it's own hot air which gets hotter and hotter. In my Dell the CPU doesn't even have it's own fan and when running it at full power (for example a compile job which takes about an hour with 10 parallel jobs) the fans don't even increase speed. You don't need much airflow to move a lot of heat but you need proper ducting to get cool air in and the hot air out.
Every standard case has airflow. Fans in the front pull cool air in, and fans at the top and back exhaust the hot air. Hot air rises on its own, you don't need fancy air ducts. If they made such a difference, why has no case manufacturer created a case with ducts? It would be easy to have large, medium and small sizes to fit different hardware. My build puts out a lot of heat, to the point where my room becomes an oven combined with the fact that the temperature in Vegas today was 106. My build is silent when stressing both the CPU and GPU. You say there is a problem with airflow in "standard ATX" cases but there isn't.