Unless you are working with small discrete MOSFETs you are unlikely to see a problem as the leakage current must be sufficient to charge the gate capacitance to the gate oxide breakdown voltage in less than half a mains cycle (assuming line frequency AC power to the element). Power MOSFETs typically have fairly large gate capacitance so more leakage current is required to reach the same gate voltage.
Most MOS ICs have ESD protection networks on their inputs which can easily handle the typical leakage currents involved, which protects the gate oxide of their input MOSFETs from overvoltage.
Most irons with mains elements have the tip hard grounded, for electrical safety and to protect components of the circuit being worked on. Its less of a problem with low voltage irons, as, to maintain mechanical strength, the ceramic insulation thickness does not scale with the element voltage. However as the element ages, and contamination (e.g from traces of flux vapour) builds up, possibly in micro-cracks, you can expect its insulation resistance to decrease. If a low voltage soldering station was not designed for the bit to be grounded via a 1Meg resistor, it would be a good idea to occasionally check the voltage across the grounding resistor and either replace the element or switch to direct grounding if it ever exceeds a few volts with the iron at max temperature and actively heating. Use a good DMM on AC V or a scope with a x10 probe, and the ground clip on the true ground end of the 1Meg resistor.
N.B. if the tip is hard grounded, it can be disastrous if you attempt to work on a circuit with charged capacitors or batteries present, if any other ground connection is present. If in doubt, and especially when soldering PCB mount batteries, isolate the board or portable equipment you are working on by removing *ALL* external connections before soldering . . . .