EEVblog Electronics Community Forum
General => Contests & Events => Topic started by: mikeselectricstuff on February 11, 2019, 01:08:46 pm
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https://www.avnet.com/wps/portal/silica/resources/training-and-events/event/green-pak-configurable-mixed-signal-ics-workshop (https://www.avnet.com/wps/portal/silica/resources/training-and-events/event/green-pak-configurable-mixed-signal-ics-workshop)
Date Location
12 February 2019 Munich, Germany (Avnet Silica Poing office)
13 February 2019 Stuttgart, Germany (relexa Waldhotel Schatten, Magstadter Str. 2-4, 70569 Stuttgart)
14 February 2019 Rothrist, Switzerland (Avnet Silica Rothrist office)
19 February 2019 Maidenhead, UK (Avnet offices Maidenhead)
20 February 2019 Stevenange, UK (Avnet offices Stevenage)
I've booked for the Stevenage one.
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Quite interesting, but probably only for high volumes ( MOQ for programmed parts is 3K ).
But I couldn't really see much that couldn't be done with a low-end PIC, with much more flexibility and lower MOQ, at only a slightly higher device cost.
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Quite interesting, but probably only for high volumes ( MOQ for programmed parts is 3K ).
Well that's a shame, I believe before Silego got acquired by Dialog the MOQ for pre-programmed was far lower. There was a recent thead (https://www.eevblog.com/forum/microcontrollers/using-greenpak-configurable-devices-in-non-otp-config/) on alternatives to pre-programming them.
But I couldn't really see much that couldn't be done with a low-end PIC, with much more flexibility and lower MOQ, at only a slightly higher device cost.
If you're not using the analog features or the simplest models that's probably true.
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There are some reprogrammable devices that can be programmed over I2C, so those would be fairly viable to use in low volumes, but apparently the OTP devices use a lot of pins for programming.