When you draw a surface mount pad in a custom Eagle library package, it has a solder paste stencil aperture (aka "cream" layer) and a solder mask aperture (aka "stop" layer) automatically generated with it.
I think these can dynamically change when the component is in your board layout, based on DRC settings.
To turn off the "automatic" generation of these layers, change the "Cream" and/or "Stop" properties of that copper pad in the package, and turn them from "on" to "off". Now you've got just a copper pad, no soldermask or paste layer. Now you can use the draw-rectangle tool, on either the stop layer or cream layer, to manually draw a fixed rectangle around the pad for that layer, with exactly the customised dimensions that you control.