DIP package has PAD or Via

[RoadRunner]

hi

   i am designing a double layer pcb which has a DIP package  microcontroller  and few smd ic

i want to know that the pad which are used by all the dip package they are via or just pads ( i mean they will appear on a single layer)


if they are just pad then how to convert them to via so that they will appear to both of the layer

what are things that i should i keep in mind while generating the Gerber files
 

[Psi]

What PCB package are you using?

[alm]

According to my crystal ball it's Eagle.

[8086]

DIP pads appear on both sides and are plated through. At least they do when I use them. I use Sparkfun's Eagle library for common packages like these.

[RoadRunner]

i m using eagle 5.11

[mikeselectricstuff]

If it has component lead through it, it's a pad. If it's only to ocnnect between layers, it's a via.
The only differences are that vias tend to not have openings in the solder resist layers, and they can be moved around by the routing process (auto or manual).

[RoadRunner]

Sir

     i want  though hole pad to appear on both side of the pcb and connected internally (via)

how to convert them to via

[alm]

Did you read the post by mikeselectricstuff just before your post? Both pads and vias are plated through in two layer designs.

[RoadRunner]

Thank you sir

 i helped me a lot