I mostly use eagle these days for RF work, it's easier than trying to do it in other programs, but only as long as I get my footprints configured correctly. In the past, I've always done the footprint modification in the actual board layout, adding polygons and vias for thermal use. I'd like to put that into some of the common packages I use, like the SOT-89 package that gets used for some MMIC amps, and the PowerSO-10 for the newer STMicroelectronics LDMOS power mosfets that I *really* like. (They are REALLY nice for modern rigbuilding!)
So here's a new footprint I drew up, that has the top copper thermal vias and thermal pads layed out. It places the parts correctly, but the polygons drawn in the footprint editor seemingly can't be named and don't seem to inherit the pin name.
Here's an example of a board layout that I would like to use these in, but as you can see, the top and bottom copper fills follow the isolation rules, and my ground plane gets jacked up.
Does anyone know how to correct this, so that my RF and power device packages can have their minimum thermal footprints when I ask for them?