Hi I'm working on a board that have a 1mm Pitch LBGA uC... I've been reading some good info about BGA scape routing and doing some test with Diptrace and so far it's seens that I will need a pcb manufacturer that is able to go down to 6/6mil with 12mil via hole/6mil annular ring
So far I was able to find OSHPark (
www.oshpark.com) but they only are able to do 13mil via holes with 7mil annular ring... with this specs the outer diameter of the via will be 27mil (7+13+7) which will give DRC errors (and be out of manufacturers specs) when placing vias between the BGA pads (See image attached via.png)
Now... I got the idea of putting the via next to its corresponding bga pad but I've concerns about doing this since it can affect the BGA soldering process... example: due to the shape of the pad being modified it can prevent(affect the bga self-alignment while reflowing the board. (See via2.png)
I was wondering if somebody knows a pcb manufacturer that offers cheap service for small prototypes (les't say 2 boards) with good enough capabilities to develop a board with the scape routing needed for this type og BGA (1mm pitch)
Also, comments on using the method displayed in via2.png will be apprecited
Thanks in advance
P.S The idea displayed on via2.png is not mine... I might seen this on one of the countless articles I've read about BGA scape routing