This is about to change because Iliya has finally been convinced/persuaded to that proper copper pour handling is necessary. I think he has even paused his development of the router to implement a copper pour solution. Even with working DRC checking, at least to some point. (My guess is that it will not initially check for isolated areas and to thin copper pour connections but this is only my personal guessing).
Note that it is possible to create copper pours even in the existing version but not practical. You have to route all connections of the copper pour net together using normal traces or the net wire will not go away making it look like you have unrouted traces even if you don't. These traces will be hidden within the copper pour once created (if placed there). On top of this, which is critical, is that copper pour is not included in DRC.
Ken, You speak of all PCB software you have seen and none have seen the via connection until refreshing the copper pour. I can tell you that obviously you have missed EdWinXP. There you never need to refresh the copper pour while working with PCB, only if you want to see the plots. But EdWinXP is a not very well known software even that it was one of the very first, it has just gone through some (major) changes over the years. If I say EE Designer, you maybe recognize it. However, EdWinXP is what I intend to leave. Still not sure if it is the right decision but I can always go back if I change my mind as I have a full license. I have just stopped updating it.