power place connections/thermal pad

[gogoman]

Hi  I have not layout a board in a while,

Given a four layer board (inner: power ground) using smd components, can the connections to the inner layer be made directly or must a thermal pad/relief be used.
Using a  via  with a angular ring of 20mil  and hole of 10 mils,  what expansion value  is recommend for a thermal relief?

If two thermal relief intersect,  resulting in 2 out of 4 spokes connecting to the plane,  does this pose a manufacturing issue.

thanks

[borghese]

The thermal relief are normally used with PTH components

With SMD pad there is normally a short track for connection to the power plane that act as thermal relief;