I've started using dry film photoresist for quick prototyping, but lining up transparency films and getting the exposure right is taking a bit more time than I was hoping for.
Here's my system. I get a sheet of clear plastic the same thickness as the board. I put matching fiducial marks on the phototools, front and back. I lay the bottom phototool on a light table, and glue a scrap of PC board material to one side. I then place the clear plastic on it, and lay the other phototool on top and align the fiducials. Then, I glue the top film to the PC board scrap, and align until I'm happy with the alignment, and put a weight on the glued area, and wait for the glue to dry. I usually use rubber cement. Not real strong, but it allows you to adjust the alignment. If you use contact cement, you'd better have the alignment perfect because you can't shift it after it sticks.
Then, you pick up the film sandwich and slide the board in it, put in a double-sided vacuum frame and expose both sides without interrupting the vacuum. This maintains the alignment between the two films.
Now, you said something about transparencies. That implies laser printers. You may be able to make decent one-sided films on a laser printer, and for 0805 and SOIC parts, that should work fine. However, unless you use really large via pads, or are doing REALLY small boards, the two films won't line up well enough over the whole board, due to mechanical-to-paper errors in the printer.
I use a home-built laser photoplotter to make my phototools, and they are accurate to a few thousandths of an inch over a foot or so.
I mostly use it to make solder stencils for commercially-made boards, so it has to match their accuracy pretty closely.
TSSOP is another whole ballpark than 0805, and I think you will have to tune everything in your process up very carefully for that to work.
Jon