I actually ordered a respin last Sunday after seeing the first comments as I couldn't find anything suitable on Farnell. I'm also fairly certain manually applying it would have made it difficult for the pads to touch the solder balls... And yes, the respin was cheap!
However it looks like you have left off the pads for some of the solder balls in the BGA? If that's the case your chances for success in soldering it are slim as the non-soldered balls will leave too much space for the soldered ones leading to broken connections.
No, that's just how the chip is designed. 0.4mm pitch with missing columns. Go figure, it's ancient technology.
Also damn, the factory400 guy answered to my thread! I'm a fan!