With low profile MLCC's, and low profile high-density BGA/micro-BGA's, we've seen a BIG shift toward no-clean fluxes as opposed to washable organic flux the past few years. It's becoming extremely difficult and expensive to wash all the flux residues out from under some of these part types, and since water-soluble fluxes tend to be mildly corrosive, entrapped residues often cause latent failures or odd signals. Heck, you should see what water-soluble fluxes do to wave solder and select solder machines in just a couple of years, particularly precision ground linear rails.
A good no-clean will usually be a less expensive process (no wash), and more modern pastes and fluxes leave very little residue compared to even 5 year old formulas. With high voltage, high frequency, or pico level measurements, sometimes the no-clean residues can cause signal issues. But we're talking gigahertz frequencies, kilovolts, and picoamps.
I'd ask them what flux and solder paste they are using. The latest batch of Kester 'High Reliability' stuff is actually VERY good for having great cleanliness results during testing. I've become quite fond of Loctite GC-10 solder paste as well, because it's so time and temp stable, but does require it to be 'worked' a bit straight from the tube before it rolls well.
But if you're going from a water-wash process, to a no-clean, also make sure to get a re-quote. You should be seeing a cost savings from not having to wash.