0.2mm shouldn't be a challenge, that is well within the placement capabilities of most equipment, the key to delivering it here will be in how accurately the alignment system can see the device, potentially making it a job a machine with laser alignment might do more accurately than camera. I place quite a few LEDs of this style but I have the recognition tuned more towards sucessfully recognising the device than to getting superaccurate alignment, all the same its pretty consistent, less so when placing domed versions.
Where you have to be careful IME with very close proximity is with things like SOIC or Opto packages, they tend to have a distinct seam in the moulding which can sometimes challenge the min/max dimensions in the datasheet. Equally the accuracy for passives "chips" is always lower on placement machines as they are volume parts where accuracy is not supposed to matter, start sticking those right next to each other and now and again it might cause problems..
That said look at this if your contractor has issues, either its closer than you think or they aren't very good. I don't think special instructions should be required here.