pure tin solder or plating plus moisture plus retained stress seems to be the recipe for the whisker formation. I saw some whiskers on a particular batch of Xilinx chips that had pure tin plating, plus the gull-wing leads were apparently formed AFTER plating. I was using a tin/lead solder, so did not heat them enough to anneal the tin plating, and whiskers grew, RIGHT at the bends, only.
I do a lot of manufacturing with SAC305 solder, and have not had any problems with those boards. That is about 1000 boards in the field, but almost all P&P and reflow, not hand soldering.
Jon