As readily available reasonably pure Hydrogen Peroxide tends to be no more than 3% (10 Vol. 0.88 Molar) concentration in many countries, it is desirable to use high concentration HCL to avoid excessive dilution, especially if you are planning to transition to air regenerated acid CuCl etching.
As others have pointed out, HCl fumes are nasty, and attack most metals, so its essential to keep the acid and any mixed etchant in an appropriate container in a well ventilated space. Its not a good idea to store either in your electronics lab or machine shop.
10% HCL solution is only 3.3 Molar, and you are aiming for a HCL Molarity of around 2.5-3.0 in your working etchant, so you simply cant get there with an acceptable H2O2 concentration starting from 3% peroxide and 10% acid. (20% HCL solution is 6.6 Molar and 30% is 9.9 Molar). If you are aiming at a 2 Molar Cu2+ concentration, that's a density of about 1.27, but if you start from 3% peroxide, and 20% HCL solution, you wont be able to get much past 0.5 Molar Cu2+ without air regeneration.
Also, once mixed, and even more so once there are metal ions in solution, the rate of decomposition of H2O2 drastically increases, so if you store it before its got a usable Cu+/Cu2+ concentration, it becomes useless. That means you need to add enough scrap copper (preferably fine stranded wire) to the etchant to use up all the remaining peroxide before storage, then air regenerate before use.
If its quick & dirty etch and chuck, peroxide as hair bleach and HCl as toilet bowl cleaner may work. but both are likely to contain additives, and if you are unlucky, the additives may attack your etch resist resulting in pinholing, or partially protect the copper surface leaving unetched flecks of copper behind. Its certainly not worth going the disposable HCl/H2O2 route if you can get commercially available PCB etchants.