My technique is:
- small saucepan with a glass lid; reduces chance of splattering and might allow a little heating from the top
- thin layer of sand in saucepan; spreads heat avoiding hotspots and enables more control of temperature profile
- gas ring, not electric hob
The only thing that doesn't allow is a "rapid" cooloff as shown in the temperature profile. That can be ameliorated by lifting the PCB out when solder has reflowed
Sounds interesting... I wonder how homogenous the heating would be with a gas ring.
That question is equally valid for an electric hob; the construction
details will matter. My (very cheap) saucepan has a relatively thick base, which will spread the heat. The sand, or rather the air in between the sand grains, will also spread the heat. I presume that would also be the case if you spread sand directly on your electric hob. Why not try it with a sacrificial/scrap board (no components) and see? (And let us know the results!)
As far as I can see, it is even: 0603 sized components anywhere on a 5cm*5cm board start to reflow more or less simultaneously. Larger components may take a little longer, but that is due to their thermal mass, not uneven heating.
I have not seen any scorching on boards' undersides. A few grains of sand lightly stick to the underside, and are simply brushed off when cool.
If I wanted to try double-sided boards, I would experiment with mounting spacers on the board and putting it in the saucepan, optionally with less sand.