I have been doing a lot of "conventional stuff" with QFP, LCC etc. I have always wanted to get into handling BGA's for prototyping and have now my first testboard with BGA's on it (CPU + SDRAM), this is just a board with no real use, just to check BGA mounting etc.
I have preheat equipment, hotair etc. I have always used leaded solder for prototyping as this was much easier. But, when I get my hands on the BGA stuff they already comes with balls (obviously) which are lead free! I guess I have a fear for the higher temperatures/handling of the non leaded stuff, but do I have to be afraid or is this really just "business as usual" although with a little higher temperatures ... ?
The packages are 180 and 54 pins with 0.8 mm spacing