The COB packaging technology is categorized as a package-free or provincial-saving package. However, this package does not eliminate the packaging process, but saves the packaging process. Compared with the SMT process, the COB packaging process is saved. Going to a few steps saves time and process to a certain extent, and also saves costs to a certain extent. SMD's production process needs to undergo solid crystal, wire bonding, dispensing, baking, stamping, splitting, color separation, tape, and patch. The COB process is simplified on this basis. First, the IC is attached to the circuit board. Then solid crystal, wire bonding, testing, dispensing, baking, and become a finished product.
In terms of the production process alone, several steps have been omitted, and industry insiders say that this can save a large part of the cost. It is worth noting that the COB package does not require reflow soldering, which is one of the advantages of COB.