You photoresist off the entire front, metal and all, and gold plate the back side with a mask, then put a layer of photoresist on and etch where it is not covered. Likely this was the first application of back etching ever, as most IC's before only wanted a solderable back and not a thinned out section. The gold is used afterwards, once you strip all the resist front and rear, to solder to the alumina substrate, which in turn has a gold silkscreened layer top and bottom used to bond it to the main substrate. This IC was made in 1986, when hybrids were still top of the pile in complexity, and with a price to match.