This originates from the recent announcement of the PIC32MZ DA line. If a chip manufacturer can cook up a multi-chip module like this and sell it within 10 dollars, it would be able to pressure the Raspberry Pi folks. The chip contains:
* An 32-bit CPU core with MMU, be it MIPS Warrior (PUC32MZ DA) or Cortex-A7 MP1 (AllWinner V3s) or Cortex-A53 MP4 (BCM2837)
* A GPU that supports OpenGL ES and hopefully OpenCL if headless chips are used.
* At least 512MB of LPDDR2 SDRAM. Hopefully 1GB LPDDR3. Since the die is hard wired in the packages, a registerless hard wired memory controller can be used (like PSRAM.)
* At least 4GB of NAND storage, can be an eMMC die packaged in directly.
* Built in primary crystal oscillator and voltage regulators.
* Single 3.3V supply
* Packages: wide-body DIP28, DIP40, QFP44, QFP64, QFP100.
Features exposed by package:
* DIP28: 1x SPI with 3CS, 1x I2C, 1x I2S, 1x UART, 4x PWM, 1x USB OTG, 20x muxed GPIO
* DIP40: add 1x I2C, 1x SPI with 3CS, 1x SDIO, 12x muxed GPIO
* QFP44: add 1x USB Host and onboard Bluetooth/Wi-Fi combo chipset (and additional SDIO and UART on the main chip to support this RF chip.)
* QFP64: add Serial Digital Video Out complex (12 signals capable of being switched between MIPI DSI-2, HDMI and DisplayPort)
* QFP100: add two CSI-2 4-lane and one GMII interface.
* QFP144: add 24-bit parallel LCD interface, 3x more USB host ports (can be internal USB Hub) and 30x muxed GPIO
Package | GPIO (muxed) | SPI (w/ 3CS) | I2C | I2S | UART | PWM | SDIO | Parallel LCD | USB 2.0 | CSI-2 | SDVO | GMII | Wireless |
DIP-28 | 20 | 1 | 1 | 1 | 1 | 4 | 0 | 0 | OTG | 0 | 0 | 0 | No |
DIP-40 | 32 | 2 | 2 | 1 | 1 | 4 | 1 | 0 | OTG | 0 | 0 | 0 | No |
QFP-44 | 32 | 2 | 2 | 1 | 1 | 4 | 1 | 0 | OTG, 1x Host | 0 | 0 | 0 | Yes |
QFP-64 | 32 | 2 | 2 | 1 | 1 | 4 | 1 | 0 | OTG, 1x Host | 0 | 1 | 0 | Yes |
QFP-100 | 32 | 2 | 2 | 1 | 1 | 4 | 1 | 0 | OTG, 1x Host | 2 | 1 | 1 | Yes |
QFP-144 | 62 | 2 | 2 | 1 | 1 | 4 | 1 | 1 | OTG, 4x Host | 2 | 1 | 1 | Yes |