If I am going to make a BGA mock up (a small module in a BGA package), what kind of encapsulant should I use?
It seems like IC related materials are only traded within the IC business, and they rarely end up in the wild.
Is there any way I can get some molding compounds (quartz filled plastic beads) or 2-part epoxy that will survive SAC305 reflow temperature?
I'm looking for a small package, less than 0.5 kG. Any suggestions where can I get my hands on such materials?