I'll add my two cents.
I have had limited experience in full production runs, but lots in prototyping - everything from DIY etching to reflow, but haven't touched BGA in a while.
For Hobbyist stuff, SSOP, TSSOP, TQFP is fine. For passives I generally shoot for 0805 but 0603 is certainly doable - providing you have spares on hand in-case you breath. I highly recommend a good set of tweezers, specifically fine ones, and angled. 0.6-0.7mm solder, with flux core, flux paste and/or pen, isopropyl alcohol with lint-free clothes and a stiff hair brush for cleaning.
I too was a bit weary of SMD, so used to use 1206 for passives, but going down to 0805 is no step at all, and one could argue given the less solder required, might even be quicker.
I have drag soldered many IC's but providing there's plenty of flux I generally get away with a tiny bit of solder on the tip, then touching the ends of the pins (where they meet the pad), solder bridges are rare, but can be handled by a bit more flux, then drawn the tip from where the pins meet the chip, outward, letting surface tension do its thing. Worst case - solder braid. I honestly think its quicker to solder SMT than DIP and requires a lot less solder.
I would invest in a hot-air station too for DFN/QFN or rework/desodering. I have an extremely cheap one with the blower inside the handle. I think Dave reviewed it once and wasn't overly keen, but it did the job, and controlled the temperature. $40 and it has a soldering iron too. I've used it for 4 years and done hundreds of boards with it. The tips are pretty poor, but they are the same size as the hakko ones so replacements are plentiful. All in all, I had no trouble making the switch. Probably should invest in a microscope or magnifying glass but so far my eyes has been enough. Avoid 0402 because for the most part in hobby stuff, its unecessary.
Edit: just realized it reads like a child narrating a play... sorry :/ just a quick post whilst waiting for my roast to finish