How do you reball BGA?

[technix]

Is this the correct procedure of rebelling BGA chips with 185 degrees Celsius lead-free solder balls and a “universal” rebelling stencil:

1. Place the chip and stencil onto the holder, aligned,
2. With a tweezer, place solder balls onto the stencil matching the cleaned pads on the chip,
3. Use a hot air gun at 215 degrees Celsius to reflow the chip,
4. The chip is reballed once no ball falls off when the chip is flipped.