That's not the general case. That's a carefully engineered case. You need several things to make it work properly:
- The self heating has to be fairly limited
- The resistors have to be heat sinked well enough that they are close to the temperature of the surrounding oven
- The oven needs to be poorly insulated (most are well insulated), so it can dissipate whatever heat the resistors produce in a sustained way, with the main heater idling.
Well, in general, you always HAVE to account for external heat sources in such oven assemblies.
You always have to adapt your special requirements to the oven design, i.e. if you have relatively low or relatively big dissipation values.. but that's a trivial statement..
In case of most OCXOs, which are a VERY common used case, the oven controller, oscillator and driver circuitry are also situated inside the oven enclosure, and these dissipate several 10 mW, despite the fact, that these ovens are relatively well thermally insulated.
As an example, which is well documented, take the HP 10811 OCXO family.
Edit: Yep, in the manual of the 10811, it's specified, the oscillator circuitry consumes 12V * 30mA (typ.), that are 360mW!! Compared to 2W steady state typ. for the oven. My other example was 500mW (1kV over 2MOhm), so that's even in the same ballpark..
In other applications, like oven stabilized zener references (LM199, LTZ1000), the reference circuitry itself also dissipates some mW, and the whole component is also quite well insulated.
Anyhow, an oven assembly always requires some degree of heat leakage to the environment , otherwise the bare oven mechanism would not work at all, instead heating up indefinitely, or not regulating properly, but that's also a trivial fact.
So you see, in general, heat dissipation has to be accounted for ..
I don't know any oven application, where this is NOT the case..
Maybe you know such real products?
Frank